Continued miniaturization, automotive electrification, 5G and Industry 4.0 demand ever increasing use of thermal solutions for performance, reliability and safety of power electronics. Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM). Traditionally used thermal greases provide good end of line performance but they can degrade. TIMs come in a wide variety of properties, physical formats and automation readiness to suit the wide variety of applications. Additionally, TIMs may be tasked with insulation reliability, adhesion and encapsulation. Hence, the selection depends on the thermal and electrical insulation needs to meet the respective application requirements. Moreover, the solution has to have manufacturability and automation in selecting the right solution TIM.