Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. These devices are expected to be more efficient and to operate under more stressful conditions, such as higher temperatures, more power cycles, etc. This is particularly true for the automotive industry, as it transitions from the fossil fuel-powered engine to the electric vehicle. SST Vacuum Reflow Systems is addressing these issues to provide extremely low-void, lead-free solder solutions for power module applications. They will present an overview of their automated solutions and test results.