The seminar presents thermal knowledge from a completely different perspective than previous thermal management seminars at APEC and is for electrical engineers of entry and intermediate levels. The seminar starts with basic thermal resistance definitions and a few examples of misunderstanding of these thermal resistances by electrical engineers, and it then presents correct usage of thermal resistances based on simulation and test data. With size reduction of DC-DC converters, co-packaged power stages are developed and optimized to reduce temperature. The seminar demonstrate package improvement in discrete MOSFETs and power stages to optimize thermal performance. It compares two popular packages, DrMOS package versus single-clip package and then presents test results of exposed-top package versus molded package. The seminar offers tips in application of heatsink and temperature measurement by using thermal cameras and thermal couples. It also discusses chimney effect of airflow in system design and analyze thermal management in some computer designs. Additional topic includes temperature sensing for temperature reporting, over temperature protection, and current sensing compensation in DC-DC converters for servers and telecommunication systems, and the seminar will provide implementations of temperature compensation in inductor DCR and MOSFET Rds(on) current sensing.