D10 - Power Converter Packaging, Integration, and EMI Considerations

Thursday, March 19, 2020

11:15 AM – 1:45 PM

Location: Poster Area

Presentations:

11:15 AM – 1:45 PM

Empirical Radiation Noise Identification and Reduction by Optimized IGBT Without Increasing Power Loss
11:15 AM – 1:45 PM

Near-Field Radiation Ems Research for Driver PCB in MMC-HVDC System: a Novel Copper Layer Based EMI Coupling Model
11:15 AM – 1:45 PM

Analysis and Evaluation of Thermally Annealed Pyrolytic Graphite Heat Spreader for Power Modules
11:15 AM – 1:45 PM

A System Power Device Technology Vertically Integrating Magnetic Substrate
11:15 AM – 1:45 PM

Demonstration of a 10 kV SiC MOSFET Based Medium Voltage Power Stack
11:15 AM – 1:45 PM

Detection of Power Switch Failures Using Discrete Fourier Transform for DC-DC Flying Capacitor Multilevel Converters
11:15 AM – 1:45 PM

Feasibility on High Frequency Resonant Networks for Induction Heating Superheated Steam Generators for Wafer Cleaning Systems
11:15 AM – 1:45 PM

A Novel DCR Current Sensing Scheme for Accurate Current Readback in Power uModule Applications
11:15 AM – 1:45 PM

System-Level Thermal Modeling of a Modular Multilevel Converter
11:15 AM – 1:45 PM

A Double-Sided Cooling 650V/30A GaN Power Module with Low Parasitic Inductance
11:15 AM – 1:45 PM

A 900A High Power Density and Low Inductive Full SiC Power Module for High Temperature Applications Based on 900V SiC MOSFETs
11:15 AM – 1:45 PM

Design of a Lightweight Low Inductance Power Module with Ceramic Baseplates