IS15 - Packaging Circuits to Make Small and Reliable Products

Wednesday, March 18, 2020

2:30 PM – 5:35 PM

Location: R01

1st Chair(s)

2:30 PM – 2:55 PM

Thermal Packaging Challenges for Next-Generation Power Electronics
2:55 PM – 3:20 PM

Full 3D Advanced Packaging Concepts for Wide Bandgap Power Electronics
3:20 PM – 3:45 PM

Ultra-High Density Double-Sided Half-Bridge Packaging with Organic Laminates
3:45 PM – 4:10 PM

5G is Broken and the Heatsink is to Blame
4:20 PM – 4:45 PM

System-Level Design Considerations for Performance Enhancing SiC Power Modules
4:45 PM – 5:10 PM

Reliability of Thermally Integrated 3D Power Packaging
5:10 PM – 5:35 PM

Using Advanced Manufacturing Techniques for Thermal Management of High-Reliability Power Components