IS22 - Modules

1st Chair(s)

• Eric Persson

  Infineon Technologies AG

Presentations:

• 8:30 AM – 8:55 AM

  How to Preserve Power Module Integrity without compromising Switching Performance
• 8:55 AM – 9:20 AM

  A Practical Performance Comparison of 300A, 1700V Si IGBT and SiC MOSFET Power Modules
• 9:20 AM – 9:45 AM

  Key Challenges in Achieving Short-Circuit Protection on SiC Power Modules using Isolated Gate Drivers
• 9:45 AM – 10:10 AM

  Increasing Power Density with Direct-Cooled SiC Power Modules in 3-Phase Inverters
• 10:35 AM – 11:00 AM

  Thermal Stability Evaluation of the Electro-Casting Copper (ECC) AlN Ceramic Substrate