There is significant trend in the industry towards higher power density and integration in power supplies. Progress made in wide bandgap devices and power packaging has accelerated this trend. Given this the reliability of wide band gap devices, new magnetics and advanced packaging now directly influences the system reliability. As power density goes up it tends to affect thermal signature as well.
In cases where total power loss is reducing due to SiC, GaN the cooling systems can be simplified and made to be more reliable. Also integration has allowed enhanced protection and reliability features to be implemented. From a practical stand point reliability can have a tradeoff with cost as well. As we all know industry wants reliable and cost effective products.
In this session, the panel will discuss, debate the merits and challenges of high level of integration in power systems. Please join us and debate this topic with our expert panelists and find out the state of the art!