Embedding technologies, 3D packaging, and additive manufacturing
Technical Dialogue Session
Power Converter Packaging, Integration, and EMI Considerations
System Power Device, Magnetic Substrate, Integration
To achieve higher power density and better noise attenuation, a new technology is presented in this paper by vertically integrating a magnetic substrate. A Buck converter is utilized as an example and an organic magnetic substrate is introduced. The power inductor is designed with an substrate and bonded onto the leadframe. The switching regulator IC is bonded on top of the magnetic substrate.The on-device input capacitors and output capacitor form a high frequency noise filtering network which can effectively attenuates noises in across a wide frequency range up to giga hertz frequencies.