Power Modules / High Density Design
Technical Dialogue Session
Power Converter Packaging, Integration, and EMI Considerations
SiC MOSFET, Power module packaging, heat sinks, reliability
A lightweight high power-density low inductance power module design is presented in this paper. This power module utilizes vertical loop design to reduce the stray inductance. Various ceramic materials have been explored for the design as baseplate materials. Compared to the conventional power module structure, simulation results show 50% reduction in maximum electric field strength and 65% reduction in CM leakage current. Dynamic testing results of the fabricated power module are presented. The power loop inductance is 1.1 nH, and the drain to source voltage sees 4.3% voltage overshoot under 700 V 25 A switching.